l 20[mm] "Length of the device"
w 15[mm] "Width of the device"
l_MC 15[mm] "Length of the epoxy mold compound"
w_MC 10[mm] "Width of the epoxy mold compound"
l_die 1.2[mm] "Side length of the pressure sensor"
l_memb 700[um] "Side length of the silicon membrane"
l_hole 800[um] "Side length of the hole in FR4"
t_FR4 1[mm] "Thickness of the FR4"
t_Si 200[um] "Thickness of the silicon"
t_memb 20[um] "Thickness of the silicon membrane"
t_glass 200[um] "Thickness of the silica glass wafer"
t_MC 1.5[mm] "Thickness of the mold compound"
cmax 140[mol/m^3] "Saturated concentration of the mold compound"
cini 40[mol/m^3] "Initial moisture concentration"
pext 1[bar] "External pressure"
t 0[s] "Time used for parametric sweep"
Dc 4e-13[m^2/s] "Diffusion coefficient"