Modeling of Electrodeposition & Electroplating with COMSOL Multiphysics® — On Demand

Electrodeposition is used in a wide range of applications, including corrosion protection and decorative finishing as well as PCB manufacturing and semiconductor processing. Modeling and simulation can be used to analyze current distribution, species transport, electrode kinetics, and evolving electrode geometries during deposition.

COMSOL Multiphysics® and its add-on Electrodeposition Module provide functionality for modeling electrodeposition processes, including moving boundaries, tertiary current distribution, electrolyte flow, and other coupled multiphysics effects that influence deposit thickness, uniformity, and quality.

This webinar will provide an overview of electrodeposition modeling in COMSOL^®, covering approaches for simulating plating processes and geometry evolution. Several application examples will be presented to illustrate typical modeling workflows and analysis techniques.