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Version 4.0a Acoustics & VibrationsStructural Mechanics reply 1 decade ago by Ivar KJELBERG
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0 Replies 2347 Views
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How can i model semiconductor and its packaging in Comsol using CAD and test under electrical, mechnical and thermal aspect.
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7 Replies 5469 Views
reply 1 decade ago by Usman Khan
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Version 4.0a reply 1 decade ago by Edgar Kaiser
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Version 4.0a reply 1 decade ago by Ivar KJELBERG
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1 Replies 3532 Views
Version 4.1 Fluid & HeatHeat Transfer & Phase ChangeComputational Fluid Dynamics (CFD)Mesh reply 1 decade ago by Ivar KJELBERG
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11 Replies 17660 Views
Version 4.0a reply 1 decade ago by Ivar KJELBERG