Thermal Expansion in a MEMS Device
Application ID: 1870
This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library.
The purpose of this model is to demonstrate the use of the Material Library in COMSOL Multiphysics. This library contains an extensive collection of materials, each represented by predefined material property datasets. These datasets include properties used across all physics interfaces; this example highlights properties pertinent to mechanical and thermal analyses. You need the Material Library to build the model.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- either the MEMS Module, or Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.
