The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
Permanent magnet manufacturers test magnets by applying a cyclic temperature load during the design process to assess the resulting thermal demagnetization. The heating process is usually slow enough that the temperature distribution inside the magnet can be considered uniform at any ... Read More
Cascaded cavity filters provide much better bandpass filter performance than single cavity filters. This example demonstrate how to use shape optimization to optimize three rectangular cavity filters coupled via slots. The calculated S-parameters show excellent out-of-band rejection. Read More
This model demonstrates how to extract the lumped parameters for an mBVD equivalent circuit from a FEM simulation and how to leverage such a model directly using the Electrical Circuit interface. A 3D layered FBAR resonator is considered as an example. Related Blog Post Leveraging the ... Read More
Flip chip (FC) is a widely used form of advanced semiconductor packaging that yields high interconnection density and good signal transmission performance of the semiconductor device as well as a reduction in size. In FC devices, the chip is placed face down and directly bonded to the ... Read More
In direct bonding, the in-plane relative displacement between corresponding points on the bonding surfaces of the top and bottom wafers, denoted as IPD (In-Plane Distortion), is the primary yield killer in the bonding process. This model can predict the entire direct wafer bonding ... Read More
Through-silicon vias (TSVs) allow chips or wafers to be connected vertically, making TSV a crucial technology for 2.5D and 3D packaging. The basic structure of a TSV consists of a deep hole penetrating a silicon substrate, a filling metal (usually copper) in the deep hole, and an ... Read More
