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Application of Solution Mapping to Reduce Computational Time in Actively Cooled Power Electronics

K. Lowe [1,2], and Rao V. Arimilli[2]
[1]Oak Ridge National Laboratory, Oak Ridge, TN, USA
[2]Department of Mechanical, Aerospace, and Biomedical Engineering, University of Tennessee, Knoxville, TN, USA
Published in 2008

In some power electronic applications the available coolant temperature is close to maximum and controlling operating temperature becomes more challenging, for which new thermal management schemes must be considered. COMSOL predicts the 3D fluid behavior and 3D temperature distribution within an actively cooled power electronic structure.

A solution mapping method is implemented to more efficiently model axisymmetric flows that lie within the heat exchanger and maintain the chip below maximum operating temperature, but fluid temperature exceeds its boiling point. Increasing fluid velocity reduces maximum fluid temperature below boiling point and demonstrates feasibility using high temperature coolant with power electronics.

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