Technical Papers and Presentations

电子设备中，扬声器系统的低频性能对用户体验影响至关重要。在诸多提升低频性能的方法中，N-bass粉的应用广泛，N-bass粉的利用效率对仿真提出了需求。本文提出了一种评估N-bass粉利用效率的仿真分析方法，使用Comsol Multiphysics中压力声学物理场中的多孔介质声学模块，评估扬声器模组中后腔的几何结构设计变化对N-bass粉利用率的影响，仿真输出后腔几何的有效灌粉区域以及对应的灌粉量。本仿真分析方法能够指导电子设备产品的几何设计，提前预估产品的低频音频性能，加快研发进度，降低时间及物料成本。 Read More

If not taking anticorrosion measures properly, or coating failure, serious corrosion problems would occur because of wind and rain erosion, which lead the risk of falling and cause incalculable consequences. The research investigates the stress distribution of different parts on the ... Read More

锂离子电池的安全长寿命运行离不开高效的热管理系统，其中浸没式液冷热管理系统的散热功率较大同时能实现电池组较高的温度一致性，是目前极具发展潜力的热管理方式。本研究利用COMSOL Multiphysics软件中的固体与流体传热模块和电池中的集总电池模块，并结合非等温流动和电化学热两个热多物理场，建立了浸没式液冷热管理系统的仿真模型，综合比较了三种浸没式液冷方式的散热能力，进一步通过COMSOL中的参数化扫描等功能研究探究了出入口位置、电池间距、冷却液热特性对浸没式液冷散热特性的影响。结果分析中采用了COMSOL丰富的后处理功能 ... Read More

This study presents a novel microfluidic chip integrated with biosensors and capillary microfluidics, specifically designed for target screening and precise fluid control. The capillary pumps facilitate spontaneous fluid delivery to the sensors, eliminating the necessity for external ... Read More

本工作的主要内容是探究软包电池在充放电循环中由电池自身产热导致的温度分布以及温度对电化学反应速率的影响。模型中的电池传热模型由八个尺寸为1cm×1cm×180μm的电池微元组成，每个电池微元被视为一个均匀热源，使用COMSOL Multiphysics中的固体传热模块。电化学模型使用COMSOL Multiphysics中的电池模块，通过P2D模型计算电池的充放电过程以及反应热。每一个P2D模型对应传热模型中的一个电池微元，将电池的反应热视为电池微元的单位体积产热量。在三维传热模型的每一个电池微元中植入一个域探针，用来测量每个电池元在充放电过程中每一个时刻的平均温度 ... Read More

本研究对PVT法生长碳化硅晶体的气相输运过程进行了模拟，该模型包含了坩埚的内部和外部，而坩埚的接缝连接处被模拟为多孔石墨，可以允许内外气体进行交换。坩埚外部的流场情况为，氮气和氩气从PVT炉的底部通道流入，混合气体从PVT炉顶部流出。坩埚内部的流场情况为，碳化硅粉末升华产生SiC2，Si2C和Si蒸气并向上升华，在籽晶处沉积。同时，坩埚内部和外部的气体物质通过多孔接缝发生交换，氮气和氩气可通过多孔接缝扩散至内部，SiC2，Si2C和Si蒸气也可通过多孔接缝到达坩埚外部。碳化硅反应气体物质的升华和沉积用 Hertz-Knudsen来描述，对流和扩散由Navier ... Read More

Liquid cooling is the most popular battery thermal management system (BTMS) at present, while suffers from high energy consumption and high temperature difference between upstream and downstream. Herein, we first use a reciprocating liquid flow-based BTMS (RLF-BTMS) for cylindrical ... Read More

As the demand for lightweight fibrous insulation materials in aerospace [1] and automotive [2] applications increases due to their benefits in reducing carbon footprints and costs [3], accurate prediction of thermal properties becomes crucial, particularly before production. The thermal ... Read More

Photonic integrated circuits (PIC) play important roles in contemporary optical communication systems. Incorporating functional materials into PICs equips passive photonic devices with active modulation capabilities, unleashing great potentials in optical signal processing, quantum ... Read More

Wafer bonding technology has become a crucial process in 3D IC integration, particularly as a key method for monolithic integration where Through-Silicon Via (TSV) technology is not used [1]. However, due to the intricate mechanical stress and interconnect reliability issues associated ... Read More