Besi Improved Memory Chip Manufacturing with Multiphysics Simulation
Stefan Behler, Besi, Switzerland
As memory chips become smaller and smaller, designers must ensure that the chips stay intact during the manufacturing process. Besi develops equipment and assembly processes for substrate and wafer packaging production in markets such as consumer electronics, automotive, industrial, and solar energy. Stefan Behler, a senior expert process engineer, used multiphysics simulation to explore and optimize a new way of peeling off the tape on a memory chip that results in less deformation of the dies. This new method is now used by semiconductor packaging factories all over the world.
Suggested Stories
Better Ways to Heat and Cool Buildings
Adsorptive climate control systems can reduce the power required to heat and cool buildings by running primarily on ...
Modeling Inertial Focusing in Straight and Curved Microfluidic Channels
In many medical procedures and tests, it is necessary to isolate cells of interest for further analysis. Microfluidics ...
Precision Performance: The Pursuit of Perfect Measurement
Brüel & Kjær, a manufacturer of transducers, microphones, and other instruments and software for sound and ...
Optimizing the Performance of Complex Building Façades
Engineers at Newtecnic specialize in complex building design, working with bold and fluid architectural shapes. To ...
