BE CAE & Test Builds a Surface-Mount Device App for Thermal Analysis
Giuseppe Petrone, BE CAE & Test, Italy
BE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and converted it into a simulation app with the Application Builder in COMSOL Multiphysics®, providing an interactive deliverable that could be used to investigate the system. Their clients are pleased to use an interactive tool with which they can investigate their system.
In the simulation app, the end user can vary the material of the solder layer and silicon die, thickness of the solder layer, and dissipated thermal power to examine the impact on maximum junction temperatures and junction-to-case thermal resistance.
Suggested Stories
Keeping LEDs Cool Gets More Manageable Through Simulation
Light-emitting diodes (LEDs) offer many benefits over incandescent lighting, such as long life spans and high luminous ...
Multiphysics Protects Wind Turbines when Lightning Strikes
Lightning Technologies, an NTS company, is a world leader in the design and validation of sophisticated lightning ...
Analyzing the LHC Magnet Quenches
Engineers and physicists at CERN go to great lengths to ensure that the high-power superconducting magnets that ...
Peeling Away Memory Chips
As memory chips become smaller and smaller, designers must ensure that the chips stay intact during the manufacturing ...
