Keynote: Using COMSOL Multiphysics^® for Circuit Board Thermal Analysis

The aerospace and defense industry requires stronger circuit boards than those needed for everyday electronics due to the boards needing to withstand extreme conditions when used in planes, satellites, space shuttles, and control towers. Modeling and simulation aids in developing and testing these circuit boards before the production process begins.

In this keynote, Russell Rioux of Northrop Grumman discusses the use of the COMSOL Multiphysics^® simulation software for performing thermal analysis of RF and mixed-signal circuit card assemblies. The presentation also covers their process for modeling and simulating thermal circuit board models with thousands of unique parts. This includes discussion of using the software’s image processing ability, which allows for incorporating complex circuit board layers into models to reduce model meshing while maintaining physical accuracy.

Russell Rioux is a thermal analyst at Northrop Grumman, working on space-based electronics. Rioux has worked in R&D, technology qualification, and hardware delivery. Currently, Rioux is the advanced packaging lead for Northrop Grumman’s Strategic Space Systems Division Technology Council.

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See another example of how Northrop Grumman engineers use modeling and simulation here: Keynote Video: Rapid Prototyping for Sonar Systems